INTRODUCTION
STRONG OF THE SUCCESS OF INDUBOND 130 MACHINE, CEDAL EQUIPMENT © ADDS TO ITS PRODUCT A NEW
TECHNOLOGY:
PINLESS MACHINE MOD.213 .
THIS IS A SINGLE DRAWER MACHINE WITH CCD REGISTRATION SYSTEM.
THE OPTICAL REGISTRATION SYSTEM GIVES MANY BENIFITS, SUCH AS:
- NO POTS ETCHING PUNCHING /DRILLING NECESSARY ANYMORE.
- NO RIVETS.
- PROCESS COST REDUCTION: NO DEDICATED TOOLS FOR INNER LAYER REGISTRATION
AND LAMINATION PRESS.
- POSSIBILITY TO WELD 8 mm MULTILAYER THICK.
THE INDUCTION WELDING IS INSTALLED ON THE MACHINE WITH ALL BENEFITS,
THAT ARE SPECIFIC TO THE SYSTEM, SUCH AS VERY HIGH STICKING RELIABILITY.
INNER LAYERS
THE INNER LAYERS ARE PREPARED FOR AN OPTICAL REGISTRATION PROCESS.
DEDICATED AREAS FOR WELDING ARE NOT NECESSARY: THE INNER LAYER FRAME
IS USED FOR THIS PURPOSE.
CEDAL EQUIPMENT WOULD SUGGESTS THE FRAME FOR GOOD PROCESS RELIABILITY.
TARGET FOR OPTICAL REGISTRATION AND WELDING ZONES
TWO TARGETS FOR OPTICAL REGISTRATION AND 4 DOUBLE WELDING ZONE
ARE REQUESTED.
THE PINLESS PROCESS
THE BLACKED INNER LAYERS ARE ALIGNED AND BONDED ONE OVER THE OTHER
AND THEN WELDED BY USING THE INDUCTIVE CURRENT.
CCD CAMERA DETECTS THE COPPER DOTS AND SUPPLIES INFORMATION TO THE COMPUTER.
THE COMPUTER SUPPLIES INFORMATION TO THE ROBOT THAT, BY VACUUM, PICK-UP
THE INNER LAYER
AND MOVES IT TO THE LAY-UP STATION.
DURING THE TRANSLATION, THE POSITION OF INNER LAYER IS ADJUSTED IN X-Y, AND
ROTATION MODE UNTIL
TO HAVE THE COPPER DOTS AT A ZERO POSITION.
THE OPERATOR POSITIONS THE PREPREG REQUESTED FOR THE LAMINATION PROCESS
OVER THE INNER.
A SECOND LAYER WILL BE PICKED-UP AND POSITIONED OVER THE FIRST ONE.
WHEN THE BOOK IS READY A PLATE MOVES TO THE BONDING STATION, AND A SECOND ONE
IS POSITIONED
FOR A NEW BOOK PREPARATION.
AFTER THE BONDING CYCLE, BOOK IS MANUALLY REMOVED FROM THE MACHINE BY OPERATOR
AND
A NEW PREPARATION BEGIN .
PERFORMANCES
SIZE mm ( inches)
min. 457 x 304 mm (18" x 12" ) ÷ max. 680 x 584 ( 26.8"x 23" )
PANEL THICKNESS mm ( mils )
min. NO LIMITATION ÷ max. 8mm ( 315mils)
INNER LAYER THICKNESS mm ( mils )
min. 0,050 mm ( 2 mils) ÷ max. 1 mm (40 mils)
COPPER THICKNESS Microns( oz )
min. 9 micrometers (1/3 Oz) ÷ max*.NO LIMITATION.
(* THICKNESS GREATER THAN 140 microns MUST BE TESTED IN ADVANCE).
INNER LAYERS LAY - OUT
TARGETS
COPPER DOTS: ø 0,8mm (31mils).
ETCHED AREA AROUND: 8 ÷ 13 (1/3 inches ÷ 0,15 inches).
COPPER AREAS FOR WELDING:
NUMBER: 4.
PATTERN: NET OR FULL COPPER.