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The secondary circuit consists of the copper reproduced on the welding areas of the layers;
when the induced current passes through these areas, generates Joule heating effect
of copper resulting in fusion of the prepreg resin and consequently sticking of all layers together.
By remaining constant the current in the primary circuit, the current of the secondary
circuit will be directly proportional to the amount of copper that makes up
the secondary circuit; the temperature of the circuit will be inversely proportional
to the mass to be heated, directly proportional to the quantity (volume) of
copper present and directly proportional to the time of passage of current in the primary circuit.

NEW INDUCTION HEAD 4G

This New Induction Head 4G has been developed for the purpose of reducing
the bonding time and at the same time increasing the bonding points.
The time can be 40% faster than the previous System: it mainly depends
of the multilayer construction.
There are four additional bonding points bringing the total at eight (four for each long side).
Thanks to the particularity of this System, it is possible to bond the area where the copper
frame is, in order to avoid to set dedicate bonding patterns (Refer to the below drawings).